Vantageo 12HH-CN8ST
Key Features
• 2U chassis supports for maximum motherboard sizes – 13.68″ x 13″, E-ATX 12″ x 13″, ATX 12″ x 10″ motherboards
• 8 x 2.5″ hot-swap SAS/SATA drive bay, 1 x 5.25″ drive bay
• 7 low-profile expansion slot(s)
• 8-port 2U TQ backplane (W/O AMI9071/72 enclosure management), support up to 8x 2.5- inch SAS/SATA HDD/SSD
• 1U 600W platinum efficiency multiple output power supply w/PMBus
• 3 x 8cm high-performance PWM fan(s)
1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
2. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
3. Intel® C622 chipset
4. Expansion slots: 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1PCI-E 3.0 x4 (in x8)
5. 2 10GbE LAN ports
6. 10 SATA3 (6Gbps) via C622
7. 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
8. 2x Port NVMe PCI-E 3.0 x4 via OCuLink
9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
10. M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2280 Key: MKey Double Height Connector
SPECIFICATIONS
Physical Stats
Form Factor
2U Chassis
Dimensions
12" x 9.6" (30.48cm x 24.38cm)
Processor / Cache
CPU
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Cores / Cache
Up to 28 Cores
Notes
BIOS version 3.2 or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP (codenamed Cascade Lake-R)
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
System Memory
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4- 2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM Slots
Memory Type
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
DIMM Sizes
RDIMM: 8GB, 16GB, 32GB, 64GB
LRDIMM: 32GB, 64GB, 128GB
3DS LRDIMM: 64GB, 128GB, 256GB
Memory Voltage
1.2V
Error Detection
Corrects single-bit errors
Expansion Slots
PCI - Express
• 1 PCI-E 3.0 x16 slot (x16 or x8)
• 1 PCI-E 3.0 x8 (x0 or x8)
• 1 PCI-E 3.0 x8
• 1 PCI-E 3.0 x4 (in x8 slot)
M.2
• M.2 Interface: PCI-E 3.0 x4 and SATA
• Form Factor: 2280
• Key: M-Key
• Double Height Connector
On-Board Devices
Chipset
Intel® C622 chipset
SATA
Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Broadcom® 3008 SW controller for 8 SAS3 (12Gbs) ports; RAID 0,1,10
Graphics
ASPEED AST2500 BMC
Network Controllers
Dual LAN with 10GBase-T with Intel X722 + Intel X557
IPMI
ASPEED AST2500
Input / Output
SATA
10 SATA3 (6Gbps) port
LAN
2 RJ45 10GBase-T ports
USB
8 USB 2.0 ports (2 rear + 6 via headers)
5 USB 3.0 ports (2 rear + 2 via headers + 1 Type A)
Serial Port / Header
2 COM Ports (1 rear, 1 header)
VGA
1 VGA port
TPM
TPM Header
System BIOS
BIOS Type
AMI UEFI
BIOS Features
ACPI 6.0
RTC (Real Time Clock) Wakeup
SMBIOS 3.0 or later
Operating Environment
Environmental Spec.
• Operating Temperature: 0°C – 50°C (32°F – 122°F)
• Non-operating Temperature: -40°C – 70°C (-40°F – 158°F)
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
Management
Software
Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, SPM, SUM, SuperDoctor® 5, Watchdog, NMI
Power Configurations
•ACPI Power Management
Power-on mode for AC power recovery
PC Health Monitoring
Voltage
+1.8V, +12V, +3.3V, +5V, +5V standby, 3.3V standby, 8 -fan status, Chassis intrusion header, Monitors CPU voltages, Supports system management utility, VBAT
FAN
8x 4-pin fan headers (up to 8 fans),
Fan speed control, Overheat LED
indication, PWM fan speed control,
System level control
Temperature
Monitoring for CPU and chassis environment, CPU thermal trip support, Thermal Monitor 2 (TM2) support, PECI
LED
CPU / System Overheat LED, UID/Remote UID, Suspend static indicator LED
Other Features
ACPI power management, Control of power-on for recovery from AC power loss, RoHS, UID, WOL
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